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IPC-TM-650 TEST METHODS

SECTION 2.1 - VISUAL TEST METHODS
2.1.1E Microsectioning
2.1.1.2A Microsectioning—Semi or Automatic Technique Microsection Equipment (Alternate)
2.1.3A Plated-Through Hole Structure Evaluation
2.1.5A Surface Examination, Unclad and Metal Clad Material
2.1.6B Thickness of Glass Fabric
2.1.8B Workmanship
2.1.9 Surface Scratch Examination Metal Clad Foil
2.1.10A Visual Inspection for Undissolved Dicyandiamide
 
SECTION 2.2 - DIMENSIONAL TEST METHODS
2.2.1A Mechanical Dimensional Verification
2.2.2B Optical Dimensional Verification
2.2.4C Dimensional Stability, Flexible Dielectric Materials
2.2.5A Dimensional Inspections Using Mircosections
2.2.6A Hole Size Measurement, Drilled
2.2.7A Hole Size Measurement, Plated
2.2.8 Location of Holes
2.2.10 Hole Location and Conductor Location
2.2.18 Determination of Thickness of Laminates by Mechanical Measurement
2.2.18.1 Determination of Thickness of Metallic Clad Laminates, Cross-sectional
2.2.19.1 Length, Width and Perpendicularity of Laminate and Prepreg Panels
 
SECTION 2.3 - CHEMICAL TEST METHODS
2.3.1.1B Chemical Cleaning of Metal Clad Laminates
2.3.3A Chemical Resistance of Insulating Materials
2.3.B Chemical Resistance, Marking Paints and Inks
2.3.4.2A Chemical Resistance of Laminates, Prepreg and Coated Foil Products, by Solvent Exposure
2.3.9D Flammability of Prepreg and Thin Laminate
2.3.10B Flammability of Laminate
2.3.15D Purity, Copper Foil or Plating
2.3.16B Resin Content of Prepreg, by Burn-off
2.3.16.1C Resin Content of Prepeg, by Treated Weight
2.3.16.2 Treated Weight of Prepreg
2.3.17D Resin Flow Percent of Prepreg
2.3.17.2B Resin Flow of "No Flow" Prepreg
2.3.18A Gel Time, Prepreg Materials
2.3.19C Volatile Content of Prepreg
2.3.25C Detection and Measurement of Ionizable Surface Contaminants by Resistivity of Solvent Extract
2.3.25.1 Ionic Cleanliness Testing of Bare PWBs
2.3.38C Surface Organic Contaminant Detection Test
2.3.42 Solder Mask - Resistance to Solvents and Cleaning Agents
 
SECTION 2.4 - MECHANICAL TEST METHODS
2.4.1E Adhesion, Tape Testing
2.4.1.1B Adhesion, Marking Paints and Inks
2.4.1.6 Adhesion, Polymer Coating
2.4.2A Ductility of Copper Foil
2.4.2.1D Flexural Fatigue and Ductility, Foil
2.4.3D Flexural Fatigue, Flexible Printed Wiring Materials
2.4.3.1C Flexural Fatigue and Ductility, Flexible Printed Wiring
2.4.3.2C Flexural Fatigue and Ductility, Flexible Metal-Clad Dielectrics
2.4.4B Flexural Strength of Laminates (at Ambient  Temperature)
2.4.4.1A Flexural Strength of Laminates (at Elevated Temperature)
2.4.5 Folding Endurance, Flexible Printed Wiring Materials
2.4.8C Peel Strength of Metallic Clad Laminates
2.4.8.1 Peel Strength, Metal Foil (Keyhole Method for Thin Laminates)
2.4.8.2A Peel Strength of Metallic Clad Laminates at Elevated Temperature (Hot Fluid Method)
2.4.8.3A Peel Strength of Metallic Clad Laminates at Elevated Temperature (Hot Air Method)
2.4.9D Peel Strength, Flexible Dielectric Materials
2.4.9.1 Peel Strength of Flexible Circuits
2.4.12A Solderability, Edge Dip Method
2.4.13F Solder Float Resistance Flexible Printed Wiring Materials
2.4.13.1 Thermal Stress of Laminate
2.4.15A Surface Finish, Metal Foil
2.4.16A Initiation Tear Strength, Flexible Insulating Materials
2.4.17.1A Propagation, Tear Strength, Flexible Insulating Materials
2.4.18B Tensile Strength and Elongation, Copper Foil
2.4.18.1A Tensile Strength and Elongation, In-House Plating
2.4.19C Tensile Strength and Elongation, Flexible Printed Wiring Materials
2.4.20 Terminal Bond Strength, Flexible Printed Wiring
2.4.21E Land Bond Strength, Unsupported Component Hole
2.4.22C Bow and Twist (Percentage)
2.4.22.1C Bow and Twist-Laminate
2.4.24C Glass Transition Temperature and Z-Axis Thermal Expansion by TMA
2.4.24.1 Time to Delamination (TMA Method)
2.4.24.6 Decomposition Temperature (Td) of Laminate Material Using TGA
2.4.25C Glass Transition Temperature and Cure Factor by DSC
2.4.27.2A Solder Mask Abrasion (Pencil Method)
2.4.28B Adhesion, Solder Mask (Non-Melting Metals)
2.4.28.1F Adhesion, Solder Resist (Mask), Tape Test Method
2.4.29C Adhesion, Solder Mask, Flexible Circuit
2.4.31A Folding, Flexible Flat Cable
2.4.33C Flexural Fatigue and Ductility, Flat Cable
2.4.36C Rework Simulation, Plated-Through Holes for Leaded Components
2.4.38A: Prepeg Scaled Flow Testing
2.4.39A Dimensional Stability, Glass Reinforced Thin Laminates
2.4.40 Inner Layer Bond Strength of Multilayer Printed Circuit Boards
2.4.41 Coefficient of Linear Thermal Expansion of Electrical Insulating Boards
2.4.41.2A Coefficient of Thermal Expansion - Strain Gage Method
 
SECTION 2.5 - ELECTRICAL TEST METHODS
2.5.1B Arc Resistance of Printed Wiring Materials
2.5.5.1B Permittivity (Dielectric Constant) and Loss Tangent (Dissipation Factor) of Insulating Material at 1MHz
2.5.5.2A Dielectric Constant and Dissipation Factor of Printed Wiring Board Material--Clip Method
2.5.5.9 Permittivity and Loss Tangent, Parallel Plate, 1MHz to 1.5 GHz
2.5.6B Dielectric Breakdown of Rigid Printed Wiring Material
2.5.6.2A Electric Strength of Printed Wiring Material
2.5.7D Dielectric Withstanding Voltage, PWB
2.5.17.1A Volume and Surface Resistivity of Dielectric Materials
   
SECTION 2.6 - ENVIRONMENTAL TEST METHODS
2.6.2.1A Water Absorption, Metal Clad Plastic Laminates
2.6.3F Moisture and Insulation Resistance, Printed Boards
2.6.3.3B Surface Insulation Resistance, Fluxes
2.6.3.5 Bare Board Cleanliness by Surface Insulation Resistance
2.6.3.7 Surface Insulation Resistance
2.6.6B Temperature Cycling, Printed Wiring Board
2.6.7A Thermal Shock and Continuity, Printed Board
2.6.7.2B Thermal Shock, Continuity and Microsection, Printed Board
2.6.8E Thermal Stress, Plated Through-Holes
2.6.14D Resistance to Electrochemical Migration, Solder Mask
2.6.14.1 Electrochemical Migration Resistance Test
2.6.25 Conductive Anodic Filament (CAF) Resistance Test: X-Y Axis
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